Simtek are able to offer both leaded and lead-free surface mount PCB assembly services.

The vast majority of assemblies are now lead-free, but both processes are still available. Tin, Silver, Copper (SAC) solder is the lead free solder paste of choice, but we are capable of running a process to whatever customer specification is required.

We can work with either fully procured components, fully free issued or a mixture of the two. Control of customer issued components is carried out using bonded stores locations, which prevent component migration.

We are currently successfully placing resistor and capacitor components with the 0402 footprint size along with other fine pitch devices including BGA's.

Circuits are inspected using A0I (Automated Optical Inspection) following reflow. Statistical methods are used to analyse any defects found so that corrective and preventative measures can be implemented.

PLANT LIST (SUMMARY)

Europlacer Iineo SMT placement machine 18k CPH
Europlacer Finesse SMT placement machines (x2) 12k CPH
Heeb Inoplacer SMT placement machine 3k CPH
BTU Paragon inline six zone convection reflow oven
Speedprint SP700AVI inline paste printing machine
DEK 265 inline paste printing machine with Vector stencil mounting system
DEK 260 paste printing machine with Vector stencil mounting system
YESTEK Scanspection AOI Automated Optical Inspection
Vision Engineering Mantis visual inspection system (x3)
JVC Digital CCD visual comparator
Seika 2001 Hot Gas SMT rework station